Despolimerización de lignina para su aprovechamiento en adhesivos para producir tableros de partículas.

Abstract

Keywords: Industrial lignins, lignosulfonate, characterization techniques, functional groups, expanded C9 formula, Mannich reaction, formaldehyde reactivity, active sites, depolymerization, hydroxymethylation, non-toxic aldehyde, glyoxal, adhesives, pMDI, phenol-formaldehyde resin, fast-curing, thermomechanical analysis (TMA), wood, particleboard, panels. Lignin-based wood adhesives, in which has been used depolymerized lignin in alkaline medium without formaldehyde in their preparation, have been prepared and tested for application to wood panels such as particleboard. The adhesive yields good results (IB>0.35) of the panels, enough to pass confortably relevant international standard specifications for exterior-grade panels. To obtain these results the present work has been divided in different parts as summarized below. The characterization of different technical lignins from five different origins such as Kraft, lignosulfonate, soda/anthraquinone, organosolv and bioetanol process lignins. These lignins were characterized to determine its chemical composition and structural characteristics. We have compared statistically different analytical methods for functional groups determination (such as phenolic and aliphatic hydroxyls, methoxyl, carbonyl, carboxyl and sulfonate groups) and selected the adequate in each case. Also, comparisons between all commercial lignins in terms of functional groups were reported. Then, the more complete and representative expanded formula C9 for each lignin under study is established. Finally, the characterization was completed to determine their potential to incorporate them in adhesives by determining their weight molecular distribution and reactivities. Once lignins have been characterized we have selected the good material for its incorporation in adhesives. Therefore, selected lignin type is based on its price and availability. If we consider that organosolv processes were in phase of development and Kraft process use this lignin to produce energy and recovering part of the reagents; the lignosulfonate is the only lignin exist in huge quantity with a price able to make attractive the possibility to incorporate them partially in wood adhesives. Unfortunately, the characterized lignosulfonate presents a low reactivity for its direct incorporation in wood adhesives. Therefore, the reactivity enhancement of lignosulfonate was obtained by simple process. This process consists to depolymerize lignin in alkaline medium and allows to obtaining lignin with good characteristics for its commercialization as a phenolic material suitable to use in wood adhesives. This lignin has a high phenolic hydroxyl, high aromatic protons content, low molecular weight and presents an increase of 55% of its active sites. This means a high hydroxymethylation level. We have produced lignin with good characteristics in the optimum conditions in pilot-scale reactor (10L) and recovered in solid form using a spray-dried system. This depolymerized lignin was hydroxymethylated with formaldehyde and glyoxal for its incorporation in adhesives. 2 Lignin-based adhesives has been prepared and tested for application to wood panels such as particleboard. These adhesives yielded good internal bond strength results of the panels, enough to pass confortably relevant international standard specifications for exterior-grade panels. Formulations based on low molecular mass lignin and presenting an increase in the relative proportion of reactive points yield better results than the higher molecular mass lignin used in the past. These lignin-based adhesives give also acceptable results at particleboard pressing times sufficiently low of industrial significance. Finally, lignin-based adhesives, in which formaldehyde has not been used in their preparation and has been substituted by non-volatile non-toxic aldehyde namely glyoxal, have been prepared and tested for particleboard. These adhesives yielded good internal bond strength results of the panels, sufficient to passe confortably relevant international standard specifications for exterior-grade panels. These adhesives also showed sufficient reactivity to yield panels in press time comparable to that of formaldehyde-based commercial adhesives. The percentage of adhesive used was optimized to produce particleboard with the requirements of the standard.