Impact of metal grain granularity on three gate-all-around advanced architectures

  1. Fernandez, J.G.
  2. Seoane, N.
  3. Comesaña, E.
  4. Kalna, K.
  5. García-Loureiro, A.
Actas:
International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

ISBN: 9781665406857

Ano de publicación: 2021

Volume: 2021-September

Páxinas: 201-205

Tipo: Achega congreso

DOI: 10.1109/SISPAD54002.2021.9592600 GOOGLE SCHOLAR
Fonte de datos: Scopus